1 / 3 www.asb.co.kr april 2010 p lerow tm ALE3025T2 internally matched lna module the plerow tm ale - series is the compactly designed surface - mount module for the use of the lna with or without the following gain block s in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bia s current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching c ircuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 2900 3150 gain db 18.5 19.5 gain flatness db 0.4 0.5 noise figure db 1.05 1.1 output ip3 (1) dbm 39 42 s11/s22 (2) db - 17/ - 13 output p1db dbm 22 23 switching time (3) m sec - supply current ma 200 220 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 29~31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured wi th two tones at an output power of 7 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground ou t line drawing (unit: mm) s 21 = 19.9 db@2900 mhz = 19.1 db@3150 mhz nf of 1.05 db over frequency unconditionally stable single 5 v supply high oip3@low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we re commend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) ALE3025T2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ.@t = 25 c, v s = 5 v, freq. = 3025 mhz, z o.sys = 50 ohms feature s description
2 / 3 www.asb.co.kr april 2010 p lerow tm ALE3025T2 internally matched lna module s - param e ters noise figure oip3 p1db 2900~3150 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr april 2010 p lerow tm ALE3025T2 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical perform ance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the ale module. therefore, c1 & c2 c apacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 c/sec) ramp - down (6 c /sec) + - ale out in c1 c2 v s tantal or mlc (multi layer c e ramic ) c a pacitor in out vs size 25x25 mm (for ale - t series C 10x10 mm) evaluation board layout
|
